Robust Power Solution: 20(110A)+2(110A)+2 power stages with ProCool II power connectors, MicroFine alloy chokes and premium metallic capacitors
Optimized Thermal Design: Massive heatsinks integrated with the I/O cover, joined by two U-shaped heatpipes and connected to the power stages with high-conductivity thermal pads, and 3D VC M.2 heatsink for one PCIe 5.0 M.2 slot
Latest M.2 Support: Three onboard PCIe 5.0 M.2 slots, plus two PCIe 4.0 M.2 slots via Q-DIMM.2, all with substantial cooling solutions